Author Archive
TRACE BENDS: Their impact on Near Fields (and EMC)
This article is about trace bends on PCBs and its potential impact on near fields and EMC. Considering the complexity of the PCBs of today, it is impossible to have a trace without a bend on it and continuing with this trend we will have to use bends more often than before. Hence in this article, I have tried explaining the effect of a bend on [...]
Stripline or Microstrip: Which is better for EMC?
This article talks about the two most commonly used routing configurations on PCBs – Microstrip and Stripline configurations. The article covers the basic structural differences, impedance calculation formulas and analysis of emission performance in a 3D simulation environment for both the configurations. In simple terms, the Microstrip is [...]
Conducted Emissions
Like radiated emissions which is unhelpful for EMC compliance, conducted emissions are completely unwanted noise that get conducted through cables that connect to and from the DUT(Device Under Test). The term conducted emissions originates from the fact that electromagnetic energy that is generated / emitted from the device is not radiated out, [...]
Impedance Matching
On a Printed Circuit Board, Impedance matching refers to the technique used by electronics engineers to match the impedance of the source driver with the impedance of the trace, generally with the use of external components. The idea behind impedance matching is to achieve maximum power transfer by minimising energy reflections. Impedance [...]